Product Description:

LFI 2130 can be used for general packaging applications, particularly those requiring a measure of shrink.


It has excellent toughness and outstanding biaxial shrink properties. The material contains only antioxidant and has very low energy consumption during processing.

Processing Conditions:

  • Extruder temperature profile: 150-170 °C
  • Frost line height: 5-7 times die diameter
  • Blow Up Ratio: 2-3
  • Recommended film thickness: 25 to 50 μm.

Please note that, these processing conditions are recommended by producer only for 100% LFI2130 resin (not in the case of blending with any other compatible material), but because of the many particular factors which are outside our knowledge and control, and may affect the use of product, no warranty is given.

Melt Flow Rate (190 °C/ 2 .16 Kg )0.3dg/minISO 1133
Density921Kg/m³ISO 1183 (A)
Impact strength31KJ/mASTM D 4272
Tear strength TD/MD45/20KN/mISO 6383-2
Yield stress TD/MD10/11MPaISO 527
Tensile Strength at Break TD/ MD24/22MPaISO 527
Tensile Strain at Break TD/MD>500/350%ISO 527
Modulus of Elasticity TD/MD150/140MPaISO 527
Coefficient of friction0.7GASTM D 1894
Blocking<5GSABTEC Method
Re-blocking20GSABTEC Method
Haze12%ASTM D1003A
Gloss (45º)55%ASTM D 2457

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