LFI 2130 can be used for general packaging applications, particularly those requiring a measure of shrink.
It has excellent toughness and outstanding biaxial shrink properties. The material contains only antioxidant and has very low energy consumption during processing.
- Extruder temperature profile: 150-170 °C
- Frost line height: 5-7 times die diameter
- Blow Up Ratio: 2-3
- Recommended film thickness: 25 to 50 μm.
Please note that, these processing conditions are recommended by producer only for 100% LFI2130 resin (not in the case of blending with any other compatible material), but because of the many particular factors which are outside our knowledge and control, and may affect the use of product, no warranty is given.
|Melt Flow Rate (190 °C/ 2 .16 Kg )||0.3||dg/min||ISO 1133|
|Density||921||Kg/m³||ISO 1183 (A)|
|Impact strength||31||KJ/m||ASTM D 4272|
|Tear strength TD/MD||45/20||KN/m||ISO 6383-2|
|Yield stress TD/MD||10/11||MPa||ISO 527|
|Tensile Strength at Break TD/ MD||24/22||MPa||ISO 527|
|Tensile Strain at Break TD/MD||>500/350||%||ISO 527|
|Modulus of Elasticity TD/MD||150/140||MPa||ISO 527|
|Coefficient of friction||0.7||G||ASTM D 1894|
|Gloss (45º)||55||%||ASTM D 2457|